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Abstract The proliferation of Internet-of-Things has promoted a wide variety of emerging applications that require compact, lightweight, and low-cost optical spectrometers. While substantial progresses have been made in the miniaturization of spectrometers, most of them are with a major focus on the technical side but tend to feature a lower technology readiness level for manufacturability. More importantly, in spite of the advancement in miniaturized spectrometers, their performance and the metrics of real-life applications have seldomly been connected but are highly important. This review paper shows the market trend for chip-scale spectrometers and analyzes the key metrics that are required to adopt miniaturized spectrometers in real-life applications. Recent progress addressing the challenges of miniaturization of spectrometers is summarized, paying a special attention to the CMOS-compatible fabrication platform that shows a clear pathway to massive production. Insights for ways forward are also presented. 

We found that temperature-dependent infrared spectroscopy measurements (i.e., reflectance or transmittance) using a Fourier-transform spectrometer can have substantial errors, especially for elevated sample temperatures and collection using an objective lens. These errors can arise as a result of partial detector saturation due to thermal emission from the measured sample reaching the detector, resulting in nonphysical apparent reduction of reflectance or transmittance with increasing sample temperature. Here, we demonstrate that these temperature-dependent errors can be corrected by implementing several levels of optical attenuation that enable convergence testing of the measured reflectance or transmittance as the thermal-emission signal is reduced, or by applying correction factors that can be inferred by looking at the spectral regions where the sample is not expected to have a substantial temperature dependence.

 

Thermal emission is the radiation of electromagnetic waves from hot objects. The promise of thermal‐emission engineering for applications in energy harvesting, radiative cooling, and thermal camouflage has recently led to renewed research interest in this topic. However, accurate and precise measurements of thermal emission in a laboratory setting can be challenging in part due to the presence of background emission from the surrounding environment and the measurement instrument itself. This problem is especially acute for thermal emitters that have unconventional temperature dependence, operate at low temperatures, or are out of equilibrium. In this paper, general procedures are described, recommended, and demonstrated for thermal‐emission measurements that can accommodate such unconventional thermal emitters.